Title:
MANUFACTURE OF LAMINATE CHIP FOR CIRCUIT ELEMENT AND LAMINATE CHIP FOR CIRCUIT FOR ELEMENT
Document Type and Number:
Japanese Patent JP3528277
Kind Code:
B2
Abstract:
PURPOSE: To improve cut size accuracy, manufacturing yield, electric characteristics, and quality, and make post-process unnecessary, by cutting the inside of a ceramic green sheet laminate, while leaving the outer peripheral part of the ceramic green sheet laminate.
CONSTITUTION: An inner electrode is printed on a ceramic green sheet composed of glass-alumina material. A new ceramic green sheet is laminated and an inner circuit is constitute. By repeating the above process, a ceramic green sheet laminate 1 wherein circuit elements are laminated by inner electrodes is molded. The laminate 1 is inserted in a metal mold 3 and 3 fixed. After heating at 80°C, the part of the ceramic green sheet laminate 1 which is 21% inside in the width direction and 16% inside in the length direction is divided into cut parts 2. The cut part 2 is 5.5mm long and 4.0mm wide. The cut part 2 is baked at 900°C for 15 minutes and molded. Thereby a laminate chip for a circuit element can be so accurately cut out that the dimensional difference between the upper bottom and the lower bottom is 3% or less. Thereby electric characteristics can be stabilized in high quality.
Inventors:
Nishimura, Hiroharu
Tokunaga, Hiromi
Hasegawa, Kenichi
Watanabe, Koichi
Tokunaga, Hiromi
Hasegawa, Kenichi
Watanabe, Koichi
Application Number:
JP28657594A
Publication Date:
May 17, 2004
Filing Date:
November 21, 1994
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B28B11/12; H05K3/00; H05K3/46; (IPC1-7): H05K3/46; H05K3/00
Attorney, Agent or Firm:
岩橋 文雄 （外２名）