PURPOSE: To reduce influence of thermal expansion and contraction of a film and to reduce size irregularities when smoothening a conductor pattern printed on a surface of a green sheet.
CONSTITUTION: A conductor pattern 3 such as a wire bonding pattern and an inside wiring pattern is printed on a surface; a through hole is shaped; film 9a, 9b are positioned in upper and lower surfaces of the green sheet 1 with a through hole full of a conductor; a position of the green sheet wherein a wire bonding part 5 is formed through a film is partially pressurized; and a conductor pattern surface of a wire bonding part is smoothened. Thereafter, a green sheet is separated from a film, a plurality of partially pressurized green sheets 1 are laminated and the laminated green sheet is pressurized to manufacture a green sheet lamination body 8. Thereafter, it is cut and burned.
AOKI MASATAKA
KAMITAMARI MAKOTO
IKEDA TAKUJI
Next Patent: MANUFACTURE OF WIRING BOARD USING COAXIAL WIRE