PURPOSE: To provide the manufacturing method, which can manufacture a highly reliable multilyered printed wiring board, which is suitable for a circuit constitution wherein relatively large current flows and a circuit constitution wherein high speed operation is required, by using a thermoplastic resin as an insulator layer.

CONSTITUTION: A conductor patterns 2a (2b and 2c) is formed by the selective etching of a conductor foil, which is formed on at least one main surface of a thermoplastic resin layer 1a (1b and 1c). A connecting through hole 3a (3b and 3c) is formed in the thickness direction of the thermoplastic resin layer 1a (1b and 1c) wherein the conductor pattern 2a (2b and 2c) is formed. The inside of the formed through hole 3a (3b and 3c) is filled with a conductive composition 4a (4b and 4c). Thereafter, a plurality of the thermoplastic resin layers 1a (1b and 1c) filled with the conductive compositions 4a (4b and 4c) are positioned and laminated. Heating and compressing molding are performed on the positioned and laminated bodies so as to form a unitary body. These steps are provided.