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Title:
MANUFACTURE OF REINFORCED FLEXIBLE WIRING BOARD
Document Type and Number:
Japanese Patent JPS641292
Kind Code:
A
Abstract:

PURPOSE: To largely improve productivity and functionality by integrally molding a flexible wiring board and a reinforcing unit by injection molding.

CONSTITUTION: A flexible wiring board 1 is formed by forming a conductor circuit 3 on one side face of a flexible base substrate 2, and forming an insulating layer 4 of a coverage material except a terminal, a land thereon. A plurality of fine through holes 5 are formed at the substrate 2 except that formed with the circuit 3 of the board 1. Such a board 1 is set in an injection metal mold, a reinforcing unit 6 is formed by injection molding an engineering plastic melted at a high temperature at the position required to reinforce the substrate 2, part is press-fitted to the hole 5 of the substrate 2, and a rivet-like state 5a is formed at opposite side. Thus, an assembly to an electronic equipment is facilitated, and, in some cases, can be integrated with a case of the equipment.


Inventors:
HIBINO YUTAKA
KIMURA TOSHIHIDE
Application Number:
JP15726987A
Publication Date:
January 05, 1989
Filing Date:
June 23, 1987
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H05K3/00; B29C45/14; H05K1/02; H05K3/20; B29L31/34; H05K1/00; (IPC1-7): B29C45/14; B29L31/34; H05K1/02; H05K3/00
Domestic Patent References:
JPS55134386A1980-10-20
Attorney, Agent or Firm:
Hideki Aoki



 
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