Title:
MANUFACTURE OF SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND ELECTRONICS
Document Type and Number:
Japanese Patent JP2001057348
Kind Code:
A
Abstract:
To enable a thin-type semiconductor chip to be kept high in manufacturing yield and a heat radiating plate to be provided for the semiconductor chip at a low cost at the same time.
A heat sink 20 is pasted on the surface of a semiconductor wafer 12 opposite to its active surface which is subjected to a polishing process as shown in figure (3). Then, the semiconductor wafer 12 is subjected to dicing together with the heat sink 20 as shown in Figure (4). By this setup, the thickness of the heat sink 20 compensates for the thinness of the semiconductor wafer 12, by which the semiconductor chip 14 can be protected against cracking and chipping when dicing is carried out. The heat sink 20 can be provided through only a wafer process.
Inventors:
KURASHIMA YOHEI
Application Number:
JP23174299A
Publication Date:
February 27, 2001
Filing Date:
August 18, 1999
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01L21/301; (IPC1-7): H01L21/301
Attorney, Agent or Firm:
Kisaburo Suzuki (2 outside)
Previous Patent: LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
Next Patent: CHEMICAL MECHANICAL POLISHING WATER DISPERSED MATERIAL
Next Patent: CHEMICAL MECHANICAL POLISHING WATER DISPERSED MATERIAL