PURPOSE: To enhance stability in a high temperature region and to suppress the dispersion in resistance values when electrodes and lead wires are fixed by applying brazing filler metal on the electrodes of a semiconductor element, brazing the lead wires to the electrodes of the semiconductor element, and sealing the semiconductor element and parts of the lead wires with glass.
CONSTITUTION: Lead wires 18 are brought into contact with the coated layers of brazing filler metals 16 on electrodes 14 at both surfaces of a thermistor element 12. The device is heated, and the brazing filler metal 16 is fused. The lead wires 18 are brazed to the electrodes 14. Under the state wherein the lead wires 18 are fixed, the thermistor element 12 is inputted into a glass cap 20. The entire glass cap 20 is heated with a carbon heater 22. The end part of the glass cap 20 is sealed. Thus a radial type thermistor 10 which is sealed with a glass coating 20' is obtained. In this way, moisture resistance and oxidation resistance are improved. Stability especially in a high temperature region is very excellent. Since the brazing filler metal is applied on the electrodes of the semiconductor element, the dispersion in resistance values as a whole is suppressed.
YONEDA YASUNOBU
SAKABE YUKIO
