PURPOSE: To enhance the fluidity of the resin filled in the space between a chip and a substrate as well as the wettability with a solder bump for reducing the voidage of the filled-in resin in relation to the title manufacturing method of semiconductor device wherein a semiconductor chip is flip chip-junctioned with the substrate.

CONSTITUTION: 1) Epoxy resin or additive polyimide resin as a main agent mixed with an organic solvent or a silicon base reactive diluent or hydrocarbon base reactive diluent furthermore mixied with a silicone base or titanium base or aluminum base coupling agent is filled in the space between the flip chip- junctioned semiconductor chip and a substrate. 2) This resin is to be defoamed under reduced pressure after finishing the filling-in step.