PURPOSE: To prevent the loading phenomenon of a gate of forming metallic mold from occurring while reducing the occurrence ratio of defective parts by a method wherein fine powder of specific epoxy resin composition is used to seal a semiconductor element.

CONSTITUTION: An epoxy resin composition containing an epoxy resin (A), a novolak phenol resin (B) and an inorganic filler (C) is crushed to 60 mesh passing powder so that a semiconductor element may be resin-sealed by low pressure transfer formation. Through these procedures, when any gelatinous component produced during the manufacturing process of epoxy resin composition is crushed by crushing said epoxy resin composition to 60 mesh passing powder for the low pressure transfer formation, the loading phenomenon of a gate of forming metallic mold can be prevented from occuring to markedly reduce the occurrence ratio of defective parts such as any unfilled parts, etc.