MANUFACTURE OF WIRING BOARD AND SEMICONDUCTOR DEVICE USING IT, AND THAT SEMICONDUCTOR DEVICE

Title:

MANUFACTURE OF WIRING BOARD AND SEMICONDUCTOR DEVICE USING IT, AND THAT SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2000294669

Kind Code:

A

Abstract:

To facilitate the handling without making package boards individual pieces, by providing a wiring board with a plurality of package boards which are equipped with slits at their peripheries, and providing one part of the slit with a coupling part which mechanically connects the package board with the periphery of the wiring board and is equipped with a recess at its one part.

A wiring board 1, which is equipped with a plurality of package boards 2, is provided with a slit 4 in the vicinity of each package board 2, and it is further provided with a coupling 5, which mechanically connects the package board 2 with the periphery 3 of the wiring board 1, at one part of the slit 4, and it is provided with a counterbore 6 at one part of the coupling 5. A plurality of package boards exist on that sheet, and the package boards 2 do not become individual pieces, so the handling of the board for the wiring board can be facilitated. Moreover, a sealing agent can be formed, making use of the counterbore 6 and the slit 4, when injecting the sealing agent for mounting electronic parts such as semiconductor chips, etc., mounted on the package board 2.

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Inventors:

SUWA MOTOHIRO
MIWA TAKASHI
NOSE FUJIAKI
HARADA MEIKIYU

Application Number:

JP9775499A

Publication Date:

October 20, 2000

Filing Date:

April 05, 1999

Export Citation:

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Assignee:

HITACHI LTD
NIPPON CMK KK

International Classes:

H01L23/12; (IPC1-7): H01L23/12

Attorney, Agent or Firm:

Yamato Tsutsui

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