MANUFACTURING DEVICE FOR BAND-FORM PACKAGE

Japanese Patent JP3599418

B2

PURPOSE: To provide a manufacturing device for band-form package, which can detect and cut off a connected part causing an unfavorable sealing, being connected with a temporary fixing tape in order to constitute a long sized band-form package, and can re-connect the front and rear parts of the cut off connected part, when a band-form package for which packages being filled with a content are continuously linked is manufactured.
CONSTITUTION: A band-form package A for which packages are continuously linked is introduced and carried by driving rolls 2, 25 to a manufacturing device 1, and a connected part K where the band-form package A is connected with a tape to make a long sized band-form package A is detected by a sensor 30. Then, the band-form packages A in front and at the rear of the connected part K which has been detected are fixed by clamping mechanisms 7, 23. Then, the connected part K is removed by cutting the center of the sealed parts of the packages in front and at the rear of the connected part K by work cutters 8, 22, and then, by making the clamp mechanisms 7, 23 approach each other, the end parts of the cut sealed part are butted to each other at the center of a connecting mechanism 20, and the outside is connected with a tape by the connecting mechanism 20.

Iwao Yamamoto
Ryoji Sugiura
Genji Asakura

JP11780595A

December 08, 2004

April 18, 1995

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Tokiwa Sangyo Co., Ltd.

B65B57/00; B65B9/00; B65B57/02; (IPC1-7): B65B57/00; B65B9/00; B65B57/02

JP6211220A
JP6298231A
JP4191237A
JP4062602U
JP58149205A

Yoshiko Tsuji
Kunio Tsuji

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