Title:
付加縮合併用硬化性シリコーン樹脂シート、波長変換シート、及び発光装置の製造方法
Document Type and Number:
Japanese Patent JP6601142
Kind Code:
B2
Abstract:
An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.
Inventors:
Takayuki Kusunoki
Takamizawa Yusuke
Hamamoto Yoshihide
Kinya Kodama
Takamizawa Yusuke
Hamamoto Yoshihide
Kinya Kodama
Application Number:
JP2015207806A
Publication Date:
November 06, 2019
Filing Date:
October 22, 2015
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/07; C08K3/01; C08L83/06; C09K11/02; C09K11/08; H01L23/29; H01L23/31
Domestic Patent References:
| JP5194930A | ||||
| JP59152955A | ||||
| JP2014167091A | ||||
| JP2009235368A |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Katsuhiko Masaki
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Katsuhiko Masaki