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Title:
多層プリント配線板用両面回路基板の製造方法
Document Type and Number:
Japanese Patent JP4489899
Kind Code:
B2
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Inventors:
Takashi Kariya
Naoshi Sugiyama
Application Number:
JP2000062923A
Publication Date:
June 23, 2010
Filing Date:
March 08, 2000
Export Citation:
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Assignee:
IBIDEN CO.,LTD.
International Classes:
H05K3/46; B23K26/16; B23K26/382; H05K3/00; H05K3/28; B23K101/42
Domestic Patent References:
JP10013028A
JP10022644A
JP8323488A
JP9275273A
Attorney, Agent or Firm:
Junzo Ogawa
Morio Nakamura



 
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