Title:
保持装置の製造方法
Document Type and Number:
Japanese Patent JP7210192
Kind Code:
B2
Abstract:
To suppress degraded controllability of a temperature distribution at a surface of a tabular member caused by a dispersion in a junction thickness, while suppressing an outflow of an adhesive material part.SOLUTION: A holding device manufacturing method includes the steps of: coating a paste adhesive material on a surface of a base member or a tabular member, to form a first adhesive material part which includes an annular part, of which shape corresponds to the outer periphery of a junction, by; pressing the first adhesive material part using a jig to align the height of the first adhesive material part; performing hardening processing of the first adhesive material part; coating a paste adhesive material on a region surrounded by the annular part of the first adhesive material part on the surface of the base member or the tabular member, to form a second adhesive material part; and performing the hardening processing of at least the second adhesive material part to form a junction on which the first adhesive material part and the second adhesive material part are hardened.SELECTED DRAWING: Figure 5
Inventors:
Shota Saito
Masahiro Inoue
Masahiro Inoue
Application Number:
JP2018161559A
Publication Date:
January 23, 2023
Filing Date:
August 30, 2018
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H01L21/683; F16B11/00
Domestic Patent References:
| JP2014165267A | ||||
| JP2007311637A | ||||
| JP2002141153A | ||||
| JP2003258072A |
Attorney, Agent or Firm:
Patent Business Corporation Alpha International Patent Office