Title:
金ボンディングワイヤ用インゴットの製造方法
Document Type and Number:
Japanese Patent JP4672203
Kind Code:
B2
Inventors:
Nobumitsu Hayashi
Application Number:
JP2001234960A
Publication Date:
April 20, 2011
Filing Date:
August 02, 2001
Export Citation:
Assignee:
Nittetsu Micro Metal Co., Ltd.
International Classes:
B22D21/00; B22D27/04; B22C1/00; B22D7/00; H01L21/60
Domestic Patent References:
| JP63072077A | ||||
| JP56069297A | ||||
| JP7011356A | ||||
| JP60244054A |
Attorney, Agent or Firm:
Shunta Naito
Hisataka Tanaka
Hisataka Tanaka