To provide a manufacturing method of a light emitting diode array by which necessary chip dimensional accuracy is obtained even in the case of using a standard dicing method and breaking off and cracking of a chip are suppressed.

In a manufacturing method of a lightemitting diode array for dicing along a dicing line formed between respective arrays of the light emitting diode array, half cut 7 by dicing is previously carried out from the rear face of a wafer in the case of dicing the Y-axis of the chip, and full dicing 8 is carried out from the front face of the wafer after this.