To provide a manufacturing method or the like for a nozzle plate which is excellent in productivity without repetition of processes by photolithography, enables patterning of highly precise nozzle holes each including a taper shape, and is excellent in ejection characteristic.
The manufacturing method includes: the process of coating a resist 101 to a surface of a silicon base material 100; the process of forming a first exposure part 120 and a second exposure part 130 of a multi-step form to the resist 101 by a plurality of the number of times of multiple focus exposure; the process of removing the resist 101 thereby making the first exposure part 120 a first resist mask 121 for forming a first nozzle part 12 and making the second exposure part 130 a second resist mask 131 of a multi-step form for forming a second nozzle part 13; and the process of forming the first nozzle part 12 and the second nozzle part 13 by carrying out dry etching to the silicon base material 100 by the first and second resist masks 121 and 131.
Kiyoshi Yasushima
Souji Sasaki
Noboru Omura
Takanashi Norio
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