Title:
半導体装置の作製方法
Document Type and Number:
Japanese Patent JP4481358
Kind Code:
B2
Inventors:
Shunpei Yamazaki
Application Number:
JP2009190690A
Publication Date:
June 16, 2010
Filing Date:
August 20, 2009
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H01L21/336; G02F1/1368; H01L21/02; H01L27/12; H01L29/786
Domestic Patent References:
| JP2000012864A | ||||
| JP4206766A | ||||
| JP10125927A | ||||
| JP5211128A | ||||
| JP9008124A | ||||
| JP5226620A | ||||
| JP9045882A |
Attorney, Agent or Firm:
Hirokuni Kamo