Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MARKING DIE
Document Type and Number:
Japanese Patent JP2740099
Kind Code:
B2
Abstract:

PURPOSE: To provide a marking die by which time for setup and control is reduced as the change of dies is not required in performing many kinds of marking and by which marking is performed without adjusting a punch height for the variation of thickness of sheet materials.
CONSTITUTION: This marking die 33 is provided with a punch guide 43 which is freely movable vertically and also rotatable, a marking chip plate 49 which is arranged at the lower part of the punch guide 43, a plural number of marking chips 51 which are loaded at suitable spaces apart around the marking chip plate 49, and a punch 57 which is fitted in the punch guide 43 and is freely movable vertically. In addition, the punch 57 is constituted of a punch head 59, punch driver 61 and punch block 63; and a spring 69 as an elastic member is interposed between the punch driver 61 and the punch block 63.


Inventors:
Hiroshi Saito
Application Number:
JP3993A
Publication Date:
April 15, 1998
Filing Date:
January 04, 1993
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Amada Metrex Co., Ltd.
International Classes:
B21C51/00; B21D22/02; B41K3/36; B44B5/00; (IPC1-7): B21D22/02; B21C51/00; B41K3/36
Domestic Patent References:
JP6384735A
JP58190150U
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)