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Title:
MATERIAL FOR FORMING PROTECTIVE FILM AND FORMING METHOD FOR RESIST PATTERN
Document Type and Number:
Japanese Patent JP2011227290
Kind Code:
A
Abstract:

To provide a material for forming a protective film which is capable of improving water repellency while suppressing a deterioration in alkali solubility of the protective film, and to provide a forming method for a resist pattern using the material for forming a protective film.

A material for forming a protective film contains an alkali-soluble polymer having a structural unit derived from a monomer represented by formula (A-1). In the formula, R0 represents a group expressed by formula (a-1) or formula (a-2), Q0 represents a divalent linkage group which may have a single bond or a fluorine atom, and R1 represents an organic group which may have a fluorine atom.


Inventors:
SHIRAI YURIKO
YOSHIDA MASAAKI
NAMIKI TAKUMI
ISHIKAWA KIYOSHI
KOSHIYAMA ATSUSHI
Application Number:
JP2010096930A
Publication Date:
November 10, 2011
Filing Date:
April 20, 2010
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/11; C08F20/10; C08F32/00; G03F7/38; H01L21/027
Domestic Patent References:
JP2009192784A2009-08-27
JP2009134174A2009-06-18
JP2010275498A2010-12-09
JP2010271708A2010-12-02
JP2010106139A2010-05-13
JP2011085919A2011-04-28
JP2009192784A2009-08-27
JP2009134174A2009-06-18
JP2010275498A2010-12-09
JP2010271708A2010-12-02
JP2010106139A2010-05-13
Foreign References:
WO2011127014A12011-10-13
Attorney, Agent or Firm:
Masayuki Masabayashi