POSITIVE PHOTOSENSITIVE COMPOSITION AND PERMANENT RESIST

Title:

POSITIVE PHOTOSENSITIVE COMPOSITION AND PERMANENT RESIST

Document Type and Number:

Japanese Patent JP2011227291

Kind Code:

A

Abstract:

To provide a positive photosensitive composition which can provide a permanent resist which is excellent in terms of transparency, can also be used as an insulating film of an active matrix substrate and has high heat resistance and chemical resistance after high heat history and to provide a permanent resist using the positive photosensitive composition and a method for manufacturing the permanent resist.

A positive photosensitive composition includes as (A) component polysiloxane compound obtained by hydrolysis and condensation of a predetermined cyclic siloxane compound and a predetermined alkoxysilane compound such that silanol groups remain, as (B) component a compound with at least two epoxy groups, as (C) component diazonaphthoquinones and as (D) component an organic solvent.

Inventors:

TAKENOUCHI HIROMI
OMI JUNICHI
SAITO SEIICHI

Application Number:

JP2010096941A

Publication Date:

November 10, 2011

Filing Date:

April 20, 2010

Export Citation:

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Assignee:

ADEKA CORP

International Classes:

C08G59/40; G03F7/075; C08G77/14; C08G77/20; G03F7/004; G03F7/023

Domestic Patent References:

JP2010101957A	2010-05-06
JPS61144639A	1986-07-02

Foreign References:

WO2009063887A1

2009-05-22

Attorney, Agent or Firm:

Osamu Hatori
Hiromi Nakano
Fukatsu Yumiko

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