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Title:
METAL BACK LAYER FORMING METHOD
Document Type and Number:
Japanese Patent JP2004247200
Kind Code:
A
Abstract:

To provide a method of forming a metal back layer having an excellent adhesiveness with a phosphor layer and an excellent cutting property of an edge part of a metal film, excellent in pressure withstanding characteristics, without generating displacement of a masking tape or entraining of air.

The forming method of the metal back layer comprises a process of forming a phosphor layer on an inner face of a face plate, a process of bonding a masking tape at a non-display area of the inner face of the face plate, a process of transcribing a transcription film, and a process of peeling off the masking tape. A base material of the masking tape has a thickness of 5 to 10 μm. As the base material of the masking tape, a polyester resin tape can be used. As an adhesive, a layer with an ethylene-vinyl acetate copolymer as a main component can be used.


Inventors:
GAMO YASUNORI
YOSHII MASAYUKI
TANAKA HAJIME
INAMURA MASAAKI
NAKAZAWA TOMOKO
ITO TAKEO
Application Number:
JP2003036513A
Publication Date:
September 02, 2004
Filing Date:
February 14, 2003
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01J9/22; (IPC1-7): H01J9/22
Attorney, Agent or Firm:
Saichi Suyama