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Title:
METAL PATTERNING METHOD
Document Type and Number:
Japanese Patent JP2012134335
Kind Code:
A
Abstract:

To provide a metal patterning method performing exposure, development and etching of a circuit pattern after a photocrosslinking resin layer is formed on a substrate and subjected to thinning with an organic alkaline aqueous solution which allows for uniform thinning even of a photocrosslinking resin layer where the photocrosslinking resin has a composition less susceptible to swelling with high productivity, and in-plane uniform and fine metal patterning.

A metal patterning method includes a step for forming a photocrosslinking resin layer on a substrate, a step for thinning the photocrosslinking resin layer with an alkaline aqueous solution containing an organic alkaline compound, and exposure, development and etching steps of a circuit pattern in this order.


Inventors:
GOKAN HIROHIKO
TOYODA YUJI
IRISAWA MUNETOSHI
KANEDA YASUO
NAKAGAWA KUNIHIRO
Application Number:
JP2010285425A
Publication Date:
July 12, 2012
Filing Date:
December 22, 2010
Export Citation:
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Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
H05K3/06; G03F7/38
Domestic Patent References:
JP2004214253A2004-07-29
JP2010160417A2010-07-22
JP2009295677A2009-12-17
JP2004214253A2004-07-29
JP2010160417A2010-07-22



 
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