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Patent Searching and Data


Title:
METALLIC SUBSTRATE WITH ELECTRICALLY CONNECTING FUNCTION
Document Type and Number:
Japanese Patent JPH03104294
Kind Code:
A
Abstract:

PURPOSE: To facilitate an assembling operation and enable an automatic assembly to be performed by comprising a metallic substrate body, an insulating layer formed thereon and a conductive layer formed thereon from a conductive pattern having an electrically connecting function.

CONSTITUTION: A metallic substrate 18 is constructed by a substrate body 22 composed of, for example, aluminum and an insulating layer 24 formed over the whole surface of the substrate body 22. First conducting layers 26 having first conductive patterns for exhibiting a signal connecting function between terminals 14a, 14b and 14c are formed. The first conducting layers 20 are constructed by first conducting lines formed by a plurality of aluminum foils. One of the crossing first conducting lines is formed in a continuous condition and the other first conducting line is formed as cut by the continuous first conducting line. Opposite ends of the cut halves are connected to each other by a first bonding wire 30 in a condition wherein it jumps the continuous first conducting line.


Inventors:
FUJITA NAGAHISA
ITO YUICHI
IZUMI TOMOJI
TANIDA HARUNORI
Application Number:
JP24074589A
Publication Date:
May 01, 1991
Filing Date:
September 19, 1989
Export Citation:
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Assignee:
MAZDA MOTOR
International Classes:
H05K1/05; (IPC1-7): H05K1/05
Attorney, Agent or Firm:
Yasunori Otsuka (1 person outside)