To obtain a novel polyimide resin having both a low coefficient of linear thermal expansion and a low dielectric constant, and a polyamic acid which gives this polyimide resin.
The polyamic acid can be obtained by reacting an acid anhydride component composed of pyromellitic anhydride and 2,2-bis(3,4- dicarboxyphenyl)hexafluoropropane with an aromatic diamine component of any one of a first aromatic amine component of 2,2'-disubstituted-4,4'- diaminobiphenyls and a second aromatic diamine component to be selected from 2,2-bis(4-aminophenoxyphenyl)propanes, 1,1-bis(4-(4-aminophenoxy)-3-t- butyl-6-methylphenyl)butane, 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane, and α,α'-bis(4-aminophenyl)diisopropyl-benzenes in an organic solvent. The polyimide resin can be obtained by heating a solution of such a polyamic acid.
MOCHIZUKI SHU
KURATA NAOKI
KANESHIRO NAOTAKA
OMOTE TOSHIHIKO
