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Title:
METHOD AND APPARATUS FOR CLEANING SOLDER PASTE PRINTING PLATE
Document Type and Number:
Japanese Patent JP2011110896
Kind Code:
A
Abstract:

To efficiently and surely clean a rotating cylindrical solder paste printing plate while continuing rotation during the operation of a solder paste printer.

The solder paste printer 100 includes a solder paste printing plate 40, a feed roller 20, a solder paste feeder 48, a squeegee 45 and a cleaning unit 10. The cleaning unit 10 includes a delivery roller 11 for delivering a cleaning sheet 39, and a winding roller 12 for winding the cleaning sheet 39; and pressure rollers 51, 52 pressing a cleaning surface to a contact surface of the printing plate 40 with a flexible printed board 30 with predetermined pressing force. During the operation of the printer 100, the cleaning surface is brought into contact with the contact surface during the n-rotation of the printing plate 40 to eliminate residue of paste 49, and a used portion is wound by the winding roller 12 to deliver an unused portion from the delivery roller 11 during the m-rotation of the printing plate 40 to change the cleaning sheet 39, thus forming a new cleaning surface.


Inventors:
AMAMIYA YUTAKA
Application Number:
JP2009271575A
Publication Date:
June 09, 2011
Filing Date:
November 30, 2009
Export Citation:
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Assignee:
FUJIKURA LTD
International Classes:
B41F35/00; B41F15/08; B41F15/12
Attorney, Agent or Firm:
Masaru Itami
Kazuya Chikatsu