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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR FORMING FILM PATTERN, CONDUCTIVE FILM WIRING, ELECTROOPTICAL APPARATUS, ELECTRONIC DEVICE, NON-CONTACT TYPE CARD MEDIUM, PIEZOELECTRIC ELEMENT, AND INK-JET RECORDING HEAD
Document Type and Number:
Japanese Patent JP2003311196
Kind Code:
A
Abstract:

To provide a method for forming a film pattern which accomplishes the thickening of a patterning film obtained by an ink-jet method and makes the thickness of the patterning film uniform by improving the shapes of edges.

Lap coating discharge is repeated in the first discharge process, and in a stage [a dry film S5 in Fig. 6 (a)] in which a film thickness comes to a certain extent close to a desired film thickness, in order to improve the shapes of the edges by the final minute adjustment of the film thickness, the second dispersion of a low concentration is discharged in the second discharge process [Fig. 6 (b)-(e)]. By discharging the second dispersion, a dry film pattern formed on a substrate can be minutely adjusted to have the desired film thickness, the film thickness is made uniform, and the shapes of the edges are improved {Fig. 6 (e)}.


Inventors:
HASHIMOTO TAKASHI
ISHIDA MASAYA
SAKAI MARI
Application Number:
JP2002118287A
Publication Date:
November 05, 2003
Filing Date:
April 19, 2002
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B41J2/045; B05C5/00; B05C9/06; B05D1/26; B05D1/34; B05D5/12; B41J2/055; B41J2/135; B41J2/14; B41J2/145; B41J2/16; G02F1/1335; G06K19/077; G09F9/00; H01B1/20; H01J9/02; H01L21/288; H01L21/3205; H01L21/768; H01L41/09; H01L41/22; H01L41/317; H01L51/50; H05B33/10; H05K3/10; H05B33/14; (IPC1-7): B05C5/00; B05C9/06; B05D1/26; B05D1/34; B05D5/12; B41J2/045; B41J2/055; G02F1/1335; G06K19/077; G09F9/00; H01B1/20; H01J9/02; H01L21/288; H01L21/3205; H01L41/09; H01L41/22; H05K3/10
Attorney, Agent or Firm:
Takashi Watanabe (2 outside)