Title:
METHOD FOR BONDING MOLDED OBJECT OF THERMOPLASTIC SATURATED NORBORNENE RESIN
Document Type and Number:
Japanese Patent JP3304416
Kind Code:
B2
Abstract:
PURPOSE: To tenaciously bond a thermoplastic saturated norbornene resin molding to an adherend to produce a bonded article which suffers little decrease in bonding strength with changing temp. even when the adherend has a coefficient of linear expansion considerably different from that of the molding.
CONSTITUTION: Those surfaces of a thermoplastic saturated norbornene resin molding and of an adherend which are to be bonded are modified with a polymer having a reactive silyl group. The resulting surfaces are bonded with an adhesive consisting mainly of an elastic epoxy resin having a Shore hardness, D, of about 40 or lower, and the adhesive is cured.
Inventors:
Toshimata Matsui
Hidenori Yukishige
Io Natsume
Hidenori Yukishige
Io Natsume
Application Number:
JP25557092A
Publication Date:
July 22, 2002
Filing Date:
August 31, 1992
Export Citation:
Assignee:
Nippon Zeon Co., Ltd.
International Classes:
C08F32/00; C08G59/30; C08J5/12; C09J163/00; (IPC1-7): C08J5/12
Domestic Patent References:
| JP3160079A | ||||
| JP3160078A |
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