Title:
METHOD FOR BONDING PLATE MATERIAL
Document Type and Number:
Japanese Patent JP3642766
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To excellently arrange respective one side faces of a plurality of plate materials on the same plane after their bonding in a plate material bonding method for mutually bonding the plate materials so that the respective one side faces of the plate materials are arranged on the same plane.
SOLUTION: When a cover 3 is bonded to the transparent plates 5 so that the surfaces (underside faces) are arranged on the same plane, after the arrangement, a pressure sensitive adhesive tape 9 is attached from the surface sides to boundaries between the cover 3 and the transparent plates (A). Then, an adhesive 7 is poured from an inside to the boundaries between the cover 3 and the transparent plates 5 (B). After the bonding is completed, the pressure sensitive adhesive tape 9 is released. The surfaces are excellently arranged on the same plane and the overflow of the adhesive 7 is favorably prevented by attaching the pressure sensitive adhesive tape 9 to the boundaries. Since the coated surface of the pressure sensitive adhesive is in contact with the adhesive 7, the pressure sensitive adhesive tape 9 is readily released by peeling the pressure sensitive adhesive from the substrate of the pressure sensitive adhesive tape 9.
Inventors:
Takahisa Ichii
Application Number:
JP2002135675A
Publication Date:
April 27, 2005
Filing Date:
May 10, 2002
Export Citation:
Assignee:
Kitagawa Industry Co., Ltd.
International Classes:
C09J5/00; (IPC1-7): C09J5/00
Domestic Patent References:
| JP7188636A | ||||
| JP4253717A |
Other References:
接着ハンドブック,1996年 6月28日,第3版,第852-855頁
Attorney, Agent or Firm:
Tsutomu Adachi