Title:
METHOD FOR BUILDING FLOORING
Document Type and Number:
Japanese Patent JP3918543
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for building a flooring, in which the flooring can be built simply in a short period without requiring skill, a removal in the case of a reforming is also facilitated and the opening of joints, the distortion of a floor face or the like due to change with time, temperature change or the like after the execution of works is also less prone to occur, in the method for building the flooring built by bonding the tabular flooring on an underfloor ground surface with adhesives.
SOLUTION: Parts of the rears of the floorings 1 are bonded with the underfloor ground surface by a hot-melt adhesive 2 while other parts of the rears of the floorings 1 are bonded with the underfloor ground surface by a double- side adhesive tape 3. It is preferable that bonding sections by the hot-melt adhesive 2 are formed at both end sections in the longitudinal direction of the rectangular floorings 1 (PQRS) and in intermediate sections as required and bonding sections by the double-side adhesive tape 3 are formed in these openings. A high-frequency adhesive tape having hot-melt adhesive layers on both surfaces of a conductive layer is used as the hot-melt adhesives 2, and heated and bonded by a high-frequency irradiation from the surface of the floorings 1.
Inventors:
Hiromasa Togasaki
Kato Shigeki
Masahiro Yamazoe
Atsushi Makiguchi
Hiroshi Shibata
Kato Shigeki
Masahiro Yamazoe
Atsushi Makiguchi
Hiroshi Shibata
Application Number:
JP2001378564A
Publication Date:
May 23, 2007
Filing Date:
December 12, 2001
Export Citation:
Assignee:
Toppan Printing Co., Ltd.
International Classes:
E04F15/00; (IPC1-7): E04F15/00
Domestic Patent References:
| JP63201256A | ||||
| JP2000110331A | ||||
| JP2001322104A | ||||
| JP2001098748A | ||||
| JP2001027037A | ||||
| JP9317133A |