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Patent Searching and Data


Title:
METHOD AND DEVICE FOR CONTROLLING TEMPERATURE OF MOLD
Document Type and Number:
Japanese Patent JP2005103548
Kind Code:
A
Abstract:

To provide a method for controlling the temperature of a mold, by which a product cavity face of the mold is previously heated with reduced energy consumption.

The method includes: a process wherein a product cavity is formed by joining at least two pieces of molds, a process wherein an outside part is heated by a heating means, a process wherein molten metal is poured into the product cavity while pouring a molten low-melting-point alloy into a space and conducting the heat of the outside part to an inside part via the low-melting-point alloy, a process wherein the heat of the poured molten metal is conducted to the outside part via the molten low-melting-point alloy, and a process wherein the poured molten metal is cooled via the inside part by a cooling means.


Inventors:
HIRATA MINORU
SAKAI TAKESHI
TAKASU SHUJI
Application Number:
JP2003330826A
Publication Date:
April 21, 2005
Filing Date:
September 24, 2003
Export Citation:
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Assignee:
SINTOKOGIO LTD
International Classes:
B22D18/02; B22C9/06; B22D17/22; B22D18/04; (IPC1-7): B22C9/06; B22D17/22; B22D18/02; B22D18/04