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Patent Searching and Data


Title:
METHOD AND DEVICE FOR LAYING OUT SEMICONDUCTOR INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JP2005004496
Kind Code:
A
Abstract:

To increase the area and power of a semiconductor integrated circuit by inserting delay adjustment elements for compensating the occurrence of clock skews caused by manufacturing variations.

When the delay time τL of a data line 306 is relatively small, the input/output flip-flop pairs 304, 305 of the data line 306 are selected so that a clock delay time τC from the flip-flop pairs 304, 305 to a clock confluence point 307 gets shorter. This allows a reduction in the number of delay adjustment elements 309 that should be inserted to avoid hold errors while taking manufacturing variations into consideration. The area of a chip and the power consumed by the chip can be reduced.


Inventors:
MORIWAKI TOSHIYUKI
TOUBO TETSURO
Application Number:
JP2003167495A
Publication Date:
January 06, 2005
Filing Date:
June 12, 2003
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G06F17/50; H01L21/82; (IPC1-7): G06F17/50; H01L21/82
Attorney, Agent or Firm:
Kazuhide Okada