Title:
METHOD AND EQUIPMENT FOR TRANSFERRING THIN PLATE MATERIAL
Document Type and Number:
Japanese Patent JP2003273187
Kind Code:
A
Abstract:
To fix an extremely thin and easy-to-warp plate material surely and quickly to a fixing part having a small gripping margin while preventing the adhesion of dust or the like.
In the method for transferring a thin plate material 7 where the thin plate material 7 is moved to a specified transfer place 8 while being grasped at the circumferential part thereof by grasping claws 36 at three or more positions of a transfer arm 22, the transfer arm 22 is turned about the axis in the direction of the vector sum of the plane of the thin plate material 7 before and after transfer and the thin plate material 7 is transferred while changing the attitude.
Inventors:
KUBO KEIJI
YOSHIZUMI KEIICHI
TAKEUCHI HIROYUKI
HANDA KOJI
KASAI TAKAAKI
YOSHIZUMI KEIICHI
TAKEUCHI HIROYUKI
HANDA KOJI
KASAI TAKAAKI
Application Number:
JP2002067407A
Publication Date:
September 26, 2003
Filing Date:
March 12, 2002
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B25J15/10; B65G49/07; G01B11/24; H01L21/50; H01L21/66; H01L21/677; H01L21/68; H01L21/683; H01L21/687; (IPC1-7): H01L21/68; B65G49/07; H01L21/50
Attorney, Agent or Firm:
Ishihara Masaru
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