To improve the quantitative determination in the evaluation method for the curing degree in an anisotropic conductive adhesive and to enable the evaluation of fluctuation of the curing degree in the connected sites and to provide a connection structure with reduced fluctuation of the curing degree.
In this evaluation method for the curing degree of an epoxy resin which uses a Raman spectrum, by utilizing a peak of the epoxy group (a Raman shift value of 2,990 cm-1 to 3,025 cm-1) which is good in the separation from other peaks, the curing degree of an anisotropic conductive adhesive is evaluated with improved quantitative determination. Further, the curing degree of fine sites of 1-100 μm are evaluated by effecting the Raman spectrum measurement under a microscope.
NOMOTO MASAHIRO
TSUKAGOSHI ISAO
