Document Type and Number:
Japanese Patent JP5252344
Kind Code:
B2
Abstract:
To provide a method of forming a thick film layer of a metal nano particle sintered body having the excellent adhesiveness to a base layer and the high conductivity on a substrate by applying a method of heating the metal nano particle dispersion liquid coating film from the substrate surface side by using a hot plate like substrate heating means.
The substrate with a coating film being plotted on its surface is arranged on a hot plate like substrate heating means which is heated at the temperature Tplate, and heated from a substrate back side in contact with the substrate heating means. The temperature : Tbottom(t) on the substrate surface side of the coating film is set to be in a range of 150-250°C, and set to the temperature selected to be lower than the boiling point Tb-solventof the dispersive solvent contained in the coating film. The surface temperature : Ttop(t) of the coating film is maintained in a range of the temperature difference ΔT(t)=äTbottom(t)-Ttop(t)}≥10°C, the coating film is heated to cause the low-temperature sintering of metal nano particles contained therein.
COPYRIGHT: (C)2010,JPO&INPIT
Inventors:
Ueda Masayuki
Hiroshi Saito
Nobuto Terada
Matsudaira Yorishige
Application Number:
JP2008151678A
Publication Date:
July 31, 2013
Filing Date:
June 10, 2008
Assignee:
Harima Chemicals Co., Ltd.
International Classes:
C23C20/02; B22F1/02; B22F9/00; B82B3/00; H01B13/00; H05K1/09; H05K3/22; H05K3/38
Domestic Patent References:
JP2007314866A | | | | |
JP2004218055A | | | | |
JP2002334618A | | | | |
Attorney, Agent or Firm:
Akio Miyazaki
Ishibashi Masayuki
Masaaki Ogata