To provide a method for grinding a semiconductor wafer, which is applicable to a wafer irrespective of its size and circuit design, contributes to cost reduction.

This method for grinding a semiconductor wafer includes: superimposing a circuit surface of the semiconductor wafer having a circuit surface including bumps formed thereon, and a surface protecting sheet via a liquid adhesive on an outer circumferential end portion of the semiconductor wafer; hardening the liquid adhesive to bond the semiconductor wafer to the surface protecting sheet; placing the surface protecting sheet side on a fixed pedestal while protecting a bump forming portion of the semiconductor wafer; and grinding the rear surface of the semiconductor wafer.