To provide a surface protecting sheet which is prevented from being pasted on a wafer even if the surface protecting sheet contacts the wafer in positioning an opening portion of the surface protecting sheet to a bump forming portion of a semiconductor wafer, and which is pasted to the wafer by a predetermined simple means after positioning.

This surface protecting sheet, used in grinding the rear surface of the semiconductor wafer, has on one surface of a substrate sheet an opening portion having a diameter smaller than the outer diameter of the semiconductor wafer to be pasted and having no thermoplastic adhesive formed thereon, and a pasting portion including a thermoplastic adhesive layer surrounding the opening portion.