To provide a method of appropriately forming a circuit board part in circuit board formation by a 1 shot laser method.
A method of manufacturing a circuit board includes steps of: (i) obtaining a substrate molding which is an insulating substrate of a circuit board by molding with a metal mold; (ii) forming a metal film on the surface of the substrate molding by metalizing on the substrate molding; (iii) partially removing the metal film by radiating laser to a circuit contour portion corresponding to a border between a circuit part and a non-circuit part of the substrate molding; and (iv) removing a metal film portion corresponding to the non-circuit part by performing soft-etching after increasing thickness of the metal film portion corresponding to the circuit part by applying an electric plating process to the substrate molding obtained through the previous step. As the metal mold which is used in the step (i), a metal mold is used in which a portion forming the circuit part is a high density region while a portion forming the non-circuit part is a low density region.
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ABE SATOSHI
TAKENAMI MASATAKA
MATSUMOTO TAKESHI
Mitsuo Tanaka
Yasuo Shibata