To provide a method of manufacturing a copper wiring board which can prevent the irregular progress of etching at the interface between a lower conductive layer and an electrolytic copper plating layer, assures the easier control of an etching rate and does not form a narrow portion at the interface between the electrolytic copper plating layer of a copper wire and the lower conductive layer after the etching.
The lower conductive layer (2) in a region where the electrolytic copper plating layer is not yet formed is removed after forming the lower conductive layer on the surface of an electrically insulated material (1), and then forming the electrolytic copper plating layer (4) in the region which becomes a circuit on the lower conductive layer. At that, the lower conductive layer is removed using an etchant including an oxidation agent which can be regenerated in the etchant.
KURIYAMA MASAYO
DEGUCHI MASAFUMI
MAKI YOSHIAKI
UCHINO TAKAICHI
