To obtain a method for manufacturing an electronic component wherein the crescent shape of an external electrode which is generated at the border of an element assembly and the external electrode can be effectively restrained even if the element assembly has a small size.
The element assembly 1 of the electronic component is dropped, and an end surface 1a of the element assembly 1 is immersed in a conductive paste film 22 which holds a predetermined thickness h on a base board 10. After that, the element assembly 1 is raised, and the end surface 1a is pulled up from the conductive paste film 22 and the external electrode 2 is formed. The conductive paste film 22 on the base board 10 is sucked through a suction hole 11 until the end surface 1a of the element assembly 1 is pulled up from the conductive paste film 22 after the end surface 1a of the element assembly 1 is immersed in the conductive paste film 22.
MIZOI AKIRA
AOKI KENICHI
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