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Title:
METHOD FOR MANUFACTURING ELECTROOPTICAL DEVICE, METHOD FOR PARTING A PLURALITY OF SUBSTRATES, SUBSTRATE FOR ELECTROOPTICAL DEVICE, AND ELECTROOPTICAL DEVICE
Document Type and Number:
Japanese Patent JP2005099709
Kind Code:
A
Abstract:

To realize a method for manufacturing an electrooptical device that securely parting a plurality of substrates used for the electrooptical device along parting lines.

The method for manufacturing the electrooptical device is a method for parting at least two stuck substrates used for the electrooptical device along the parting lines. The method includes a sticking process of sticking a 1st substrate and a 2nd substrate which has a plurality of grooves or one wide groove formed on one surface within a specified width along a parting line on the surface of the 2nd substrate where the plurality of grooves or one groove is formed and a parting process of parting the 1st and 2nd stuck substrates by making a crack along the parting line on the opposite surface from the surface of the 1st substrate which is stuck on the 2nd substrate.


Inventors:
SEKIGUCHI YUJI
Application Number:
JP2004176919A
Publication Date:
April 14, 2005
Filing Date:
June 15, 2004
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B29D11/00; C03B33/07; G02F1/1333; G09F9/00; G02F1/13; (IPC1-7): G02F1/13; C03B33/07; G02F1/1333; G09F9/00
Attorney, Agent or Firm:
Masahiko Ueyanagi
Fujitsuna Hideyoshi
Osamu Suzawa