To prevent damage of an electrooptical element during etching processing for thinning a glass substrate when a plurality of electrooptical elements are taken from a mother board and formed.
The method of manufacturing the electrooptical devices includes steps of: forming constituent elements each of which constitutes an electrooptical device in a plurality of electrooptical device forming regions A of the mother board 1; forming a plurality of wall parts 3 disposed to be separated from each other in the inner surface peripheral part of the mother board 1; sticking a pair of mother boards sandwiching the constituent elements and the wall parts 3 therebetween to form a mother board stuck body; packing a resin from the end side of the mother board stuck body and forming a resin layer so as to cover the outer side region of the wall parts of the mother board stuck body and enter the inner side of the wall parts from gaps between the wall parts adjacent to each other; etching the mother board stuck body to thin each of a pair of substrates; and separating each of electrooptical devices from thinned mother board stuck body.
| JP2016109918 | IMAGE DISPLAY DEVICE |
| WO/1995/004791 | LIGHT MODULATING DEVICE HAVING A SILICON-CONTAINING MATRIX |
Osamu Suzawa
Kazuhiko Miyasaka