To provide a printed circuit board with big peel strength, and a method for manufacturing a printed circuit board and a printed circuit board finishing machine capable of shortening a manufacturing time and reducing a manufacturing cost.
The method for manufacturing a printed circuit board 1 includes the steps of forming a resist layer 5 on a surface of the board 1 whose surface is an insulating layer 2a, irradiating a position (a first position) that is connected to a conductive pattern 3 in an inner layer with a CO2 laser from a surface side of the layer 5 to form a hole 6 that is to be connected to the pattern 3 from the surface of the layer 5, forming a hole 8 and a trench 9 with each depth that are not connected to the conductor layer in the inner layer at second positions from the surface of the layer 5 by irradiating the positions (the second positions) where a pattern with the first position is formed with an excimer laser (a second laser), filling conductive substances in the holes 6, 8 and the trench 9 to form the conductive patterns 11, 12, and allowing a part of the conductive patterns to be protruded from the surface of the layer 2a by removing the layer 5.
AOYAMA HIROSHI
KANETANI YASUHIKO
| JP2004253605A | 2004-09-09 | |||
| JP2006060150A | 2006-03-02 | |||
| JP2004247549A | 2004-09-02 | |||
| JP2001267724A | 2001-09-28 | |||
| JP2006005252A | 2006-01-05 | |||
| JP2003110240A | 2003-04-11 | |||
| JP2004349357A | 2004-12-09 | |||
| JPH07336055A | 1995-12-22 |