Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND FILM FOR FORMING WIRING BOARD
Document Type and Number:
Japanese Patent JP2022186473
Kind Code:
A
Abstract:
To provide a method for manufacturing a semiconductor device and a film for forming wiring boards, which enables the formation of a laser ablation layer with uniform thickness on a carrier substrate.SOLUTION: A film 10 for forming a wiring board having a laser ablation layer 11, an adhesion layer 12 located on the laser ablation layer 11, and a protective film 14 located on the adhesion layer 12 is prepared. The protective film 14 of the film 10 for forming the wiring board is peeled off, the laser ablation layer 11 and the adhesion layer 12 of the film 10 for forming the wiring board is transferred onto the carrier substrate 21, and the rewiring layer 30 is formed on the laser ablation layer 11. The rewiring layer 30 is peeled off from the carrier substrate 21 by radiating the laser beam L to the laser ablation layer 11.SELECTED DRAWING: Figure 7
Inventors:
ISOJIMA SEIICHI
YAMAKATA TOMOKI
SAKAYORI KATSUYA
TAWARAYA SEIJI
YAMAKATA TOMOKI
SAKAYORI KATSUYA
TAWARAYA SEIJI
Application Number:
JP2021094708A
Publication Date:
December 15, 2022
Filing Date:
June 04, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H01L23/12; B32B37/14
Attorney, Agent or Firm:
Nakamura Yukitaka
Miyajima Manabu
Yukihiro Hotta
Takuhisa Murata
Miyajima Manabu
Yukihiro Hotta
Takuhisa Murata