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Title:
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2013243294
Kind Code:
A
Abstract:

To provide a method of manufacturing a light-emitting diode package using a thermosetting resin in good yield.

The method of manufacturing a light-emitting diode package using a thermosetting resin sequentially performs the steps of: spraying water, an electrolyte aqueous solution, an organic compound-containing aqueous solution, or an organic compound soluble in water onto a lead frame and a molded body to completely wet them; performing electrolysis using a lead frame part as a cathode; and jetting ultrahigh-pressure water to the lead frame and the molded body.


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Inventors:
HORI MITSUHIRO
HIRABAYASHI KAZUHIKO
OZAKI SHUHEI
TOZAWA TOMOKAZU
IWAHARA TAKANAO
Application Number:
JP2012116612A
Publication Date:
December 05, 2013
Filing Date:
May 22, 2012
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
H01L33/48; C08L83/05; C08L83/07; H01L21/56



 
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