METHOD OF PRODUCING CHIP COMPONENT AND CHIP COMPONENT

Title:

METHOD OF PRODUCING CHIP COMPONENT AND CHIP COMPONENT

Document Type and Number:

Japanese Patent JP2017157849

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip component and a chip component capable of improving miniaturization and productivity, dimensional accuracy of external dimensions, and external appearance.SOLUTION: The method of manufacturing a chip component includes the steps of: forming an element in each of a plurality of chip component regions set on the surface of a substrate; forming a groove having a predetermined depth from the surface of the substrate in a boundary region of the plurality of chip component regions; and grinding the back surface of the substrate until reaching the groove to divide the substrate into a plurality of chip components.SELECTED DRAWING: Figure 27G

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Inventors:

NUKAGA EIJI
TAMAGAWA HIROSHI
KONDO YASUHIRO
MATSUURA KATSUYA

Application Number:

JP2017085638A

Publication Date:

September 07, 2017

Filing Date:

April 24, 2017

Export Citation:

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Assignee:

ROHM CO LTD

International Classes:

H01C17/065; B24B1/00; H01C1/14; H01C7/00; H01C17/242; H01G4/255; H01G4/33; H01G4/38; H01G13/00

Domestic Patent References:

JP2003158002A	2003-05-30
JPS636804A	1988-01-12
JPS63248112A	1988-10-14
JPH0611320U	1994-02-10

Attorney, Agent or Firm:

Patent Business Corporation Ai Patent Office

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