Title:
METHOD FOR PRODUCING LEAD FRAME
Document Type and Number:
Japanese Patent JP3804534
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a lead frame by etching in which fine terminal pitch of an inner lead and scaling-down are dealt with.
SOLUTION: The method for producing a lead frame comprises a first etching step for forming a recess E in a metal exposed part on at least one side, a step for coating the recess with hot melt resin, a second etching step for wet etching the other side to project softened hot melt resin in the recess from an initial stage through part to the other side and forming a through part by etching using etching liquid flowing from the boundary of the projecting part B and the recess E, and a step for removing an etching preventive layer and a resist film D by stripping.
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Inventors:
Osamu Koga
Ryuji Ueda
Ryuji Ueda
Application Number:
JP2002001113A
Publication Date:
August 02, 2006
Filing Date:
January 08, 2002
Export Citation:
Assignee:
Toppan Printing Co., Ltd.
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP9022975A | ||||
| JP8222682A | ||||
| JP4005849A |
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