Title:
METHOD FOR PRODUCING SILICA PARTICLE, METHOD FOR PRODUCING SILICA SOL, POLISHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR WAFER AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2022109711
Kind Code:
A
Abstract:
To provide a method for producing silica particles that prevents the occurrence of fine particles.SOLUTION: A method for producing silica particles includes subjecting tetraalkoxysilane to hydrolysis reaction and condensation reaction, in which, from the start to end of the hydrolysis reaction and the condensation reaction, changes in the concentration of water within the reaction system are controlled within 3 mass%. There are also provided: a polishing method that performs polishing with a polishing composition containing a silica sol obtained by the silica sol production method; a method for producing a semiconductor wafer, including the polishing method; and a method for producing a semiconductor device, including the polishing method.SELECTED DRAWING: None
Inventors:
KATO TOMOHIRO
NAGINO YUKI
SHIMADA YUTA
YONEMORI TSUTOMU
KAWASE YASUHIRO
NAGINO YUKI
SHIMADA YUTA
YONEMORI TSUTOMU
KAWASE YASUHIRO
Application Number:
JP2021005174A
Publication Date:
July 28, 2022
Filing Date:
January 15, 2021
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C01B33/18; B24B37/00; C01B33/141; C09K3/14; H01L21/304