Title:
超微粒銅粉、超微粒銅粉スラリー及び超微粒銅粉スラリーの製造方法
Document Type and Number:
Japanese Patent JP4662760
Kind Code:
B2
Abstract:
It is an object to provide a superfine copper powder slurry which enables finer-pitch wirings formation on the substrates when it is used for an electroconductive ink or an electroconductive paste for wirings. In order to achieve the object, a superfine copper powder slurry produced by suspending a superfine copper powder having powder characteristics of the value D TEM (micron meter) of 0.01 to 0.1, the ratio D 50/ D TEM of 1.0 to 1.5 and the ratio grain size/D TEM of 0.2 to 1 in a solvent, where (D TEM is) an average primary particle diameter of the powder particle diameter directly measured from observation image of TEM and calculated with observation magnification, and D 50 is a particle diameter at 50% cumulative particle size examined by Doppler scattering photo analysis.
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Inventors:
Aoki Akira
Nakamura Yoshinobu
Takahiko Sakagami
Katsuhiko Yoshimaru
Nakamura Yoshinobu
Takahiko Sakagami
Katsuhiko Yoshimaru
Application Number:
JP2004371493A
Publication Date:
March 30, 2011
Filing Date:
December 22, 2004
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
B22F1/00; B22F1/0545; B22F9/24
Domestic Patent References:
| JP11140511A | ||||
| JP2003342621A |
Other References:
J.DURISIN、他3名,Mechanochemical method of nanocrystalline powder copper preparation,Journal of Materials Science Letters,米国,1994年 5月 1日,Vol.13 No.9,Page.688-689
Attorney, Agent or Firm:
Katsuhiro Yoshimura