Title:
製造プロセスを制御する方法及び関連する装置
Document Type and Number:
Japanese Patent JP7227352
Kind Code:
B2
Abstract:
Disclosed is a method for controlling a manufacturing process for manufacturing semiconductor devices. The method comprises obtaining performance data indicative of the performance of the manufacturing process, the performance data comprising values for a performance parameter across a substrate subject to the manufacturing process. A process correction for the manufacturing process is determined based on the performance data and of at least one control characteristic related to one or more control parameters of the manufacturing process. The determining step is further based on an expected stability of the manufacturing process when applying the process correction.
Inventors:
Kamari, Mohammad, Reza
Peterson, Brennan
Peterson, Brennan
Application Number:
JP2021507847A
Publication Date:
February 21, 2023
Filing Date:
July 03, 2019
Export Citation:
Assignee:
ASM L Netherlands B.V.
International Classes:
G03F7/20; G01B11/00
Domestic Patent References:
| JP2005175282A | ||||
| JP2009015514A | ||||
| JP2018500600A | ||||
| JP2014529909A | ||||
| JP10091211A | ||||
| JP2016133566A | ||||
| JP2004509407A | ||||
| JP2012190364A |
Attorney, Agent or Firm:
Morishita Kenki
Takeshi Aoki
Takeshi Aoki