Title:
COMPOUND, RESIN, RESIST COMPOSITION, AND METHOD FOR PRODUCING RESIST PATTERN
Document Type and Number:
Japanese Patent JP2021188040
Kind Code:
A
Abstract:
To provide a compound capable of producing a resist pattern having good CD uniformity (CDU), a resin, and a resist composition containing the same.SOLUTION: The compound represented by formula (I), the resin, and the resist composition are provided. [In the formula, L1 represents a single bond or -CO-O-*; R5 represents a hydrogen atom, an alkylcarbonyl group or an acid-labile group; and m2 and m3 each represent an integer of 1-3 and m5 represents 1 or 2, provided that 3≤m2+m3+m4+m5≤5.]SELECTED DRAWING: None
More Like This:
JPS5817105 | IONIZING RADIATION-SENSITIVE MATERIAL |
JPH07247305 | PRODUCTION OF BROMINATED POLYSTYRENE |
Inventors:
MASUYAMA TATSURO
NAKAGAWA TAKUYA
ICHIKAWA KOJI
NAKAGAWA TAKUYA
ICHIKAWA KOJI
Application Number:
JP2021085461A
Publication Date:
December 13, 2021
Filing Date:
May 20, 2021
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08F12/16; C07C43/23; C07C43/315; C07C69/157; C07C69/653; C07C69/96; C08F20/30; G03F7/004; G03F7/039; G03F7/20
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation
Previous Patent: Adhesives and adhesive films
Next Patent: Methods for Producing Compounds, Resins, Resist Compositions and Resist Patterns
Next Patent: Methods for Producing Compounds, Resins, Resist Compositions and Resist Patterns